Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame
Several candidate alloys have been suggested as high-temperature lead-free solder for Si die attachment by different researchers. Among them, Zn-Al based alloys have proper melting range and excellent thermal/electrical properties. In this study, Zn-Al-Mg-Ga solder wire was used to attach Ti/Ni/Ag m...
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| Main Authors: | , , , |
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| Format: | Article |
| Published: |
Springer
2012
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/5453/ |
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