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Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi

In this paper, the oxidation and wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi solder alloys has been investigated. The alloys were subjected to 200 degrees C in oxygen rich environment. Weight gain curves reveal that the oxidation behaviour obey the parabolic rate law. X-Ray photo electron...

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Main Authors: Jaffery, Syed Hassan Abbas, Sabri, Mohd Faizul Mohd, Rozali, Shaifulazuar, Hasan, Syed Waqar, Mahdavifard, Mohammad Hossein, AL-Zubiady, Dhafer Abdul-ameer Shnawah, Ravuri, Balaji Rao
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Published: Elsevier 2022
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TJ Mechanical engineering and machinery
Online Access:http://eprints.um.edu.my/40808/
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spelling my.um.eprints.408082023-09-27T04:26:57Z http://eprints.um.edu.my/40808/ Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi Jaffery, Syed Hassan Abbas Sabri, Mohd Faizul Mohd Rozali, Shaifulazuar Hasan, Syed Waqar Mahdavifard, Mohammad Hossein AL-Zubiady, Dhafer Abdul-ameer Shnawah Ravuri, Balaji Rao TJ Mechanical engineering and machinery In this paper, the oxidation and wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi solder alloys has been investigated. The alloys were subjected to 200 degrees C in oxygen rich environment. Weight gain curves reveal that the oxidation behaviour obey the parabolic rate law. X-Ray photo electron spectroscopy (XPS) reveals the presence of SnO and SnO2 oxide layer on the surface of Sn-0.7Cu solder alloys. SnO was formed as the basic oxide layer. However, at higher temperature SnO transforms into SnO2. Addition of Bi results in the formation of Bi2O3. The Pilling-Bedworth ratio of SnO, SnO2 and Bi2O3 oxides are 1.28, 1.35 and 1.23 respectively. These ratios confirm the passive nature of oxide layers. Wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi were investigated on Cu substrate. The addition of Bi and Fe improves the wetting properties of Sn-0.7Cu solder alloys. Alloying with Bi and Fe results in growth suppression of intermetallic compound at the interface. Increase in spreading rate, decrease in wetting angle and solder height reveals better performance of the Sn-0.7Cu-0.05Fe-2Bi solder alloy. Elsevier 2022-12 Article PeerReviewed Jaffery, Syed Hassan Abbas and Sabri, Mohd Faizul Mohd and Rozali, Shaifulazuar and Hasan, Syed Waqar and Mahdavifard, Mohammad Hossein and AL-Zubiady, Dhafer Abdul-ameer Shnawah and Ravuri, Balaji Rao (2022) Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi. Microelectronics Reliability, 139. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2022.114802 <https://doi.org/10.1016/j.microrel.2022.114802>. 10.1016/j.microrel.2022.114802
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Jaffery, Syed Hassan Abbas
Sabri, Mohd Faizul Mohd
Rozali, Shaifulazuar
Hasan, Syed Waqar
Mahdavifard, Mohammad Hossein
AL-Zubiady, Dhafer Abdul-ameer Shnawah
Ravuri, Balaji Rao
Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi
description In this paper, the oxidation and wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi solder alloys has been investigated. The alloys were subjected to 200 degrees C in oxygen rich environment. Weight gain curves reveal that the oxidation behaviour obey the parabolic rate law. X-Ray photo electron spectroscopy (XPS) reveals the presence of SnO and SnO2 oxide layer on the surface of Sn-0.7Cu solder alloys. SnO was formed as the basic oxide layer. However, at higher temperature SnO transforms into SnO2. Addition of Bi results in the formation of Bi2O3. The Pilling-Bedworth ratio of SnO, SnO2 and Bi2O3 oxides are 1.28, 1.35 and 1.23 respectively. These ratios confirm the passive nature of oxide layers. Wetting behaviour of Sn-0.7Cu and Sn-0.7Cu-0.05Fe-2Bi were investigated on Cu substrate. The addition of Bi and Fe improves the wetting properties of Sn-0.7Cu solder alloys. Alloying with Bi and Fe results in growth suppression of intermetallic compound at the interface. Increase in spreading rate, decrease in wetting angle and solder height reveals better performance of the Sn-0.7Cu-0.05Fe-2Bi solder alloy.
format Article
author Jaffery, Syed Hassan Abbas
Sabri, Mohd Faizul Mohd
Rozali, Shaifulazuar
Hasan, Syed Waqar
Mahdavifard, Mohammad Hossein
AL-Zubiady, Dhafer Abdul-ameer Shnawah
Ravuri, Balaji Rao
author_facet Jaffery, Syed Hassan Abbas
Sabri, Mohd Faizul Mohd
Rozali, Shaifulazuar
Hasan, Syed Waqar
Mahdavifard, Mohammad Hossein
AL-Zubiady, Dhafer Abdul-ameer Shnawah
Ravuri, Balaji Rao
author_sort Jaffery, Syed Hassan Abbas
title Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi
title_short Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi
title_full Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi
title_fullStr Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi
title_full_unstemmed Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi
title_sort oxidation and wetting characteristics of lead-free sn-0.7cu solder alloys with the addition of fe and bi
publisher Elsevier
publishDate 2022
url http://eprints.um.edu.my/40808/
_version_ 1781704528642441216
score 13.211869

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