Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment
In this work, the iron (Fe) and bismuth (Bi) added (0.05 wt% Fe and 1 wt% or 2 wt% Bi) Sn-1Ag-0.5Cu (SAC105) lead-free solder alloys were prepared and their microstructure and tensile properties under severe thermal environments were extensively investigated and compared with the base alloy SAC105....
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| Main Authors: | , , , , , |
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| Format: | Article |
| Published: |
Elsevier
2018
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/22563/ https://doi.org/10.1016/j.microrel.2018.01.015 |
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