Cover Image

Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging

This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in this work involves s...

Full description

Saved in:
Bibliographic Details
Main Authors: Quadir, M.Z., Singh, Gurbinder, Rickard, W.D.A., Haseeb, A.S. Md. Abdul
Format: Article
Published: Elsevier 2020
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.um.edu.my/25376/
https://doi.org/10.1016/j.matlet.2019.126833
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.um.eprints.25376
record_format eprints
spelling my.um.eprints.253762020-08-17T03:41:52Z http://eprints.um.edu.my/25376/ Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging Quadir, M.Z. Singh, Gurbinder Rickard, W.D.A. Haseeb, A.S. Md. Abdul TJ Mechanical engineering and machinery This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in this work involves simultaneous application of laser heat and ultrasonic pressure. The beneficial effects of laser heating are apparent to overcoming the processing challenges associated with high hardness of copper. The application of laser yields columnar gains and grain size gradient. The laser-assisted samples have undergone a different deformation mechanism which is indicated by the non-localized nature of deformation. The dynamic thermal restorations in the laser-assisted sample are obvious. © 2019 Elsevier B.V. Elsevier 2020 Article PeerReviewed Quadir, M.Z. and Singh, Gurbinder and Rickard, W.D.A. and Haseeb, A.S. Md. Abdul (2020) Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging. Materials Letters, 259. p. 126833. ISSN 0167-577X https://doi.org/10.1016/j.matlet.2019.126833 doi:10.1016/j.matlet.2019.126833
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Quadir, M.Z.
Singh, Gurbinder
Rickard, W.D.A.
Haseeb, A.S. Md. Abdul
Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging
description This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in this work involves simultaneous application of laser heat and ultrasonic pressure. The beneficial effects of laser heating are apparent to overcoming the processing challenges associated with high hardness of copper. The application of laser yields columnar gains and grain size gradient. The laser-assisted samples have undergone a different deformation mechanism which is indicated by the non-localized nature of deformation. The dynamic thermal restorations in the laser-assisted sample are obvious. © 2019 Elsevier B.V.
format Article
author Quadir, M.Z.
Singh, Gurbinder
Rickard, W.D.A.
Haseeb, A.S. Md. Abdul
author_facet Quadir, M.Z.
Singh, Gurbinder
Rickard, W.D.A.
Haseeb, A.S. Md. Abdul
author_sort Quadir, M.Z.
title Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging
title_short Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging
title_full Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging
title_fullStr Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging
title_full_unstemmed Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging
title_sort substructural phenomena in cu wire bond after laser assisted manufacturing in electronic packaging
publisher Elsevier
publishDate 2020
url http://eprints.um.edu.my/25376/
https://doi.org/10.1016/j.matlet.2019.126833
_version_ 1680857025101168640
score 13.211869

Similar Items