Staff View: Open-cell copper foam joining: joint strength and interfacial behaviour

Open-cell copper foam joining: joint strength and interfacial behaviour

A copper (Cu) foam was brazed with Cu-4.0Sn-9.9Ni-7.8P filler foil for joint strength and interface analysis. Brazed 50 pores per inch (PPI) Cu foam yielded a maximum compressive strength of 14.4 MPa with a 127% increment compared to nonbrazed Cu foam. 15 PPI Cu foam produced a maximum shear strengt...

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Main Authors:	Zahri, Nur Amirah Mohd, Yusof, Farazila, Ariga, Tadashi, Haseeb, A.S. Md. Abdul, Mansoor, Muhammad Adil, Sukiman, Nazatul Liana
Format:	Article
Published:	Taylor & Francis 2019
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.um.edu.my/23981/ https://doi.org/10.1080/02670836.2019.1661649
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id	my.um.eprints.23981
record_format	eprints
spelling	my.um.eprints.239812020-03-10T04:09:49Z http://eprints.um.edu.my/23981/ Open-cell copper foam joining: joint strength and interfacial behaviour Zahri, Nur Amirah Mohd Yusof, Farazila Ariga, Tadashi Haseeb, A.S. Md. Abdul Mansoor, Muhammad Adil Sukiman, Nazatul Liana TJ Mechanical engineering and machinery A copper (Cu) foam was brazed with Cu-4.0Sn-9.9Ni-7.8P filler foil for joint strength and interface analysis. Brazed 50 pores per inch (PPI) Cu foam yielded a maximum compressive strength of 14.4 MPa with a 127% increment compared to nonbrazed Cu foam. 15 PPI Cu foam produced a maximum shear strength of 2.7 MPa. Scanning electron microscopy showed that the thickness of the brazed seam decreased with increasing the Cu foam’s PPI. The formation of the Cu, Cu3P (P: phosphorus) and Ni3P (Ni: nickel) at the Cu/Cu foam interface was validated using energy-dispersive X-ray spectroscopy (EDX) and X-ray diffraction. EDX line scanning analysis revealed the diffusion of P and Ni into Cu foam, which took place via capillary force action. © 2019, © 2019 Institute of Materials, Minerals and Mining. Taylor & Francis 2019 Article PeerReviewed Zahri, Nur Amirah Mohd and Yusof, Farazila and Ariga, Tadashi and Haseeb, A.S. Md. Abdul and Mansoor, Muhammad Adil and Sukiman, Nazatul Liana (2019) Open-cell copper foam joining: joint strength and interfacial behaviour. Materials Science and Technology, 35 (16). pp. 2004-2012. ISSN 0267-0836 https://doi.org/10.1080/02670836.2019.1661649 doi:10.1080/02670836.2019.1661649
institution	Universiti Malaya
building	UM Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaya
content_source	UM Research Repository
url_provider	http://eprints.um.edu.my/
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Zahri, Nur Amirah Mohd Yusof, Farazila Ariga, Tadashi Haseeb, A.S. Md. Abdul Mansoor, Muhammad Adil Sukiman, Nazatul Liana Open-cell copper foam joining: joint strength and interfacial behaviour
description	A copper (Cu) foam was brazed with Cu-4.0Sn-9.9Ni-7.8P filler foil for joint strength and interface analysis. Brazed 50 pores per inch (PPI) Cu foam yielded a maximum compressive strength of 14.4 MPa with a 127% increment compared to nonbrazed Cu foam. 15 PPI Cu foam produced a maximum shear strength of 2.7 MPa. Scanning electron microscopy showed that the thickness of the brazed seam decreased with increasing the Cu foam’s PPI. The formation of the Cu, Cu3P (P: phosphorus) and Ni3P (Ni: nickel) at the Cu/Cu foam interface was validated using energy-dispersive X-ray spectroscopy (EDX) and X-ray diffraction. EDX line scanning analysis revealed the diffusion of P and Ni into Cu foam, which took place via capillary force action. © 2019, © 2019 Institute of Materials, Minerals and Mining.
format	Article
author	Zahri, Nur Amirah Mohd Yusof, Farazila Ariga, Tadashi Haseeb, A.S. Md. Abdul Mansoor, Muhammad Adil Sukiman, Nazatul Liana
author_facet	Zahri, Nur Amirah Mohd Yusof, Farazila Ariga, Tadashi Haseeb, A.S. Md. Abdul Mansoor, Muhammad Adil Sukiman, Nazatul Liana
author_sort	Zahri, Nur Amirah Mohd
title	Open-cell copper foam joining: joint strength and interfacial behaviour
title_short	Open-cell copper foam joining: joint strength and interfacial behaviour
title_full	Open-cell copper foam joining: joint strength and interfacial behaviour
title_fullStr	Open-cell copper foam joining: joint strength and interfacial behaviour
title_full_unstemmed	Open-cell copper foam joining: joint strength and interfacial behaviour
title_sort	open-cell copper foam joining: joint strength and interfacial behaviour
publisher	Taylor & Francis
publishDate	2019
url	http://eprints.um.edu.my/23981/ https://doi.org/10.1080/02670836.2019.1661649
_version_	1662755206427836416
score	13.211869

Open-cell copper foam joining: joint strength and interfacial behaviour

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