Characterisation of insulated Cu wire ball bonding
Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Published: |
Maney Publishing
2014
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/15473/ |
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