封面图片

Electrodeposition of lead‐free solder alloys

Purpose – The purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)‐free solder alloys, so that new studies can be carried out to solve processing issues. Design/methodology/approach – The paper reviews the available reports on the electrodeposition...

Saved in:

书目详细资料
Main Authors:	Goh, Y., Haseeb, A.S. Md. Abdul, Sabri, M.F.M.
格式:	Article
出版:	Emerald 2013
主题:	TA Engineering (General). Civil engineering (General)
在线阅读:	http://eprints.um.edu.my/11753/ http://www.emeraldinsight.com/doi/full/10.1108/09540911311309031 http://dx.doi.org/10.1108/09540911311309031
标签:	添加标签没有标签, 成为第一个标记此记录!

相似书籍

Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
由: Goh, Y., et al.
出版: (2013)

Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame
由: Haque, A., et al.
出版: (2012)

Friction and wear characteristics of electrodeposited nanocrystalline nickel-tungsten alloy films
由: Haseeb, A.S. Md. Abdul, et al.
出版: (2008)

Thermal decomposition study of electrodeposited Fe-C and Fe-Ni-C alloys by differential scanning calorimetry
由: Haseeb, A.S. Md. Abdul, et al.
出版: (2001)

Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging
由: Zhou, Ding, et al.
出版: (2022)

Electrodeposition and characterization of SN-BI lead-free soldier alloys / Goh YingXin
由: Goh, Ying Xin
出版: (2015)

Effects of molybdenum nanoparticles on lead-free tin-based solder / Md. Arafat Mahmood
由: Md. Arafat, Mahmood
出版: (2012)

Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications
由: Haj-Taieb, M., et al.
出版: (2008)

Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
由: Bakir, Mohammed Luay
出版: (2012)

Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films
由: Haseeb, A.S. Md. Abdul, et al.
出版: (2011)

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate
由: Tay, S.L., et al.
出版: (2013)

$Nanoindentation and micro-mechanical fracture toughness of electrodeposited nanocrystalline Ni-W alloy films$

Nanoindentation and micro-mechanical fracture toughness of electrodeposited nanocrystalline Ni-W alloy films
由: Armstrong, D.E.J., et al.
出版: (2012)

Thermomigration in lead-free solder joints
由: Abdul Hamid, M. F, et al.
出版: (2008)

Effect of nickel doping on interfacial reaction between lead-free solder and ni-p substrate
由: Osman, Saliza Azlina, et al.
出版: (2012)

Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
由: Hashim, Muhammad Syafiq
出版: (2023)

Development of Sn–Cu–Sb alloys for making lead- and bismuth-free pewter
由: Wong, Y.H., et al.
出版: (2014)

Cr-Ni Alloy Electrodeposition and Comparison with Conventional Pure Cr Coating Technique
由: Moniruzzaman, M., et al.
出版: (2012)

Optimization On Laser Soldering Parameters Onto Lead-Free Solder Joint
由: T. J., Nabila, et al.
出版: (2017)

The effect of alloying element in lead-free solders on intermetallics growth with enimag surface finish
由: Jaidi, Zolhafizi
出版: (2020)

Effect of reflow soldering and isothermal aging on interfacial microstructure between lead-free solder alloy and different surface finishes
由: Tan, C. L., et al.
出版: (2006)

Effect of addition cobalt nanoparticles on Sn-Ag-Cu lead-free solder
由: Tay, S.L., et al.
出版: (2010)

Mechanics of solder/IMC interface of lead-free solder interconnects in ball grid array assembly
由: Asasaari, S. F. M., et al.
出版: (2022)

Interfacial microstructure growth mechanism of lead-free solder using laser soldering
由: Muhammad Asyraf, Abdullah
出版: (2024)

Catalyst free single-step fabrication of SnO2/ZnO core–shell nanostructures
由: Tharsika, T., et al.
出版: (2014)

$Fatigue fracture process of lead-free solder joints in BGA package$

Fatigue fracture process of lead-free solder joints in BGA package
由: Tamin, M.N., et al.
出版: (2012)

Wettability of low silver content lead-free solder alloy
由: Dharma, I., et al.
出版: (2009)

Formation and nanomechanical properties of intermetallic compounds in electrodeposited Cu-Sn-Co multilayers
由: Goh, Yi Sing, et al.
出版: (2021)

Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subjected to Electromigration
由: Bashir, M.N., et al.
出版: (2016)

Studies on electrodeposition behavior of Sn–Bi alloys in plating baths modified by hydroquinone and gelatin
由: Goh, Y., et al.
出版: (2016)

Pulsed electrodeposition
由: -, Suryanto
出版: (2011)

Effects of addition of copper particles of different size to Sn-3.5Ag solder
由: Nadia, A., et al.
出版: (2012)

Electrodeposition of copper and lead on palm shell activated carbon in a flow-through electrolytic cell
由: Issabayeva, G., et al.
出版: (2006)

Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders
由: Ali, B., et al.
出版: (2016)

Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi
由: Jaffery, Syed Hassan Abbas, et al.
出版: (2022)

Bismuth-argentum alloys as alternative high temperature lead-free solder
由: Rosilli, Rohaizuan
出版: (2012)

$Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints$

Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints
由: Goh, Y., et al.
出版: (2015)

Ionic liquids as additives on the electrodeposition of cobalt, nickel and its alloy onto copper in acidic sulfate bath
由: Omar, Inam Mohammedayoub
出版: (2022)

Electrodeposition of alloys
由: -, Suryanto
出版: (2011)

Lead-free flux effect in lead-free solder joint improvement
由: Eu, P.L., et al.
出版: (2017)

Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting
由: Tan, Ai Ting
出版: (2017)