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Effects of Zn addition on the intermetallic formation and joint strength of Sn-3.5Ag-1.0Cu solders / Ramani Mayappan and Iziana Yahya

The need to replace lead-based solders has received considerable attention among researchers because of their toxicity. The Sn-Ag-Cu family is the most promising candidate. However, these solder systems require some improvement in terms of their performances in terms of mechanical properties. In thi...

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Main Authors: Mayappan, Ramani, Yahya, Iziana
Format: Article
Language:English
Published: Penerbit UiTM (UiTM Press) 2025
Subjects:
Shear (Mechanics)
Online Access:https://ir.uitm.edu.my/id/eprint/111163/1/111163.pdf
https://ir.uitm.edu.my/id/eprint/111163/
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spelling my.uitm.ir.1111632025-03-05T23:56:42Z https://ir.uitm.edu.my/id/eprint/111163/ Effects of Zn addition on the intermetallic formation and joint strength of Sn-3.5Ag-1.0Cu solders / Ramani Mayappan and Iziana Yahya srj Mayappan, Ramani Yahya, Iziana Shear (Mechanics) The need to replace lead-based solders has received considerable attention among researchers because of their toxicity. The Sn-Ag-Cu family is the most promising candidate. However, these solder systems require some improvement in terms of their performances in terms of mechanical properties. In this study, Sn-3.5Ag-1.0Cu solder was investigated with the addition of 0.1, 0.4 and 0.7 wt.% Zn. The solder was prepared using a powder metallurgy method to form the discs. An intermetallic compound study was conducted by melting a solder disc on a Cu substrate at 250 oC for 1 min. For the shear strength study, the solder was melted at 250 oC on two pieces of the Cu substrate. Aging process was conducted in an oven at 150 oC for 1000 h under an air atmosphere. For the intermetallic study, the aged solder joint was cross-sectioned, mounted in epoxy resin, and observed under a Scanning Electron Microscope. The solder joint specimens were tested using an Instron machine and the fracture surfaces were examined under a Scanning Electron Microscope. The Cu6 Sn5 intermetallic compound was initially formed with scalloped morphology. This intermetallic structure transformed into a flat structure at higher aging temperatures and durations. As aging progressed, another thin and flat intermetallic layer was formed near the Cu interface. The intermetallic compound was identified to be Cu3 Sn. The solder joint strength degraded at a later stage of aging owing to the excessive growth of intermetallics with the 0.7 wt.% exhibit higher values. The fracture mode displays ductile failure at lower aging temperatures and times, but shows brittle failure at higher aging temperatures and longer times. Penerbit UiTM (UiTM Press) 2025-03 Article PeerReviewed text en https://ir.uitm.edu.my/id/eprint/111163/1/111163.pdf Effects of Zn addition on the intermetallic formation and joint strength of Sn-3.5Ag-1.0Cu solders / Ramani Mayappan and Iziana Yahya. (2025) Scientific Research Journal <https://ir.uitm.edu.my/view/publication/Scientific_Research_Journal/>, 22 (1): 1. pp. 1-17. ISSN 1675-7009
institution Universiti Teknologi Mara
building Tun Abdul Razak Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Mara
content_source UiTM Institutional Repository
url_provider http://ir.uitm.edu.my/
language English
topic Shear (Mechanics)
spellingShingle Shear (Mechanics)
Mayappan, Ramani
Yahya, Iziana
Effects of Zn addition on the intermetallic formation and joint strength of Sn-3.5Ag-1.0Cu solders / Ramani Mayappan and Iziana Yahya
description The need to replace lead-based solders has received considerable attention among researchers because of their toxicity. The Sn-Ag-Cu family is the most promising candidate. However, these solder systems require some improvement in terms of their performances in terms of mechanical properties. In this study, Sn-3.5Ag-1.0Cu solder was investigated with the addition of 0.1, 0.4 and 0.7 wt.% Zn. The solder was prepared using a powder metallurgy method to form the discs. An intermetallic compound study was conducted by melting a solder disc on a Cu substrate at 250 oC for 1 min. For the shear strength study, the solder was melted at 250 oC on two pieces of the Cu substrate. Aging process was conducted in an oven at 150 oC for 1000 h under an air atmosphere. For the intermetallic study, the aged solder joint was cross-sectioned, mounted in epoxy resin, and observed under a Scanning Electron Microscope. The solder joint specimens were tested using an Instron machine and the fracture surfaces were examined under a Scanning Electron Microscope. The Cu6 Sn5 intermetallic compound was initially formed with scalloped morphology. This intermetallic structure transformed into a flat structure at higher aging temperatures and durations. As aging progressed, another thin and flat intermetallic layer was formed near the Cu interface. The intermetallic compound was identified to be Cu3 Sn. The solder joint strength degraded at a later stage of aging owing to the excessive growth of intermetallics with the 0.7 wt.% exhibit higher values. The fracture mode displays ductile failure at lower aging temperatures and times, but shows brittle failure at higher aging temperatures and longer times.
format Article
author Mayappan, Ramani
Yahya, Iziana
author_facet Mayappan, Ramani
Yahya, Iziana
author_sort Mayappan, Ramani
title Effects of Zn addition on the intermetallic formation and joint strength of Sn-3.5Ag-1.0Cu solders / Ramani Mayappan and Iziana Yahya
title_short Effects of Zn addition on the intermetallic formation and joint strength of Sn-3.5Ag-1.0Cu solders / Ramani Mayappan and Iziana Yahya
title_full Effects of Zn addition on the intermetallic formation and joint strength of Sn-3.5Ag-1.0Cu solders / Ramani Mayappan and Iziana Yahya
title_fullStr Effects of Zn addition on the intermetallic formation and joint strength of Sn-3.5Ag-1.0Cu solders / Ramani Mayappan and Iziana Yahya
title_full_unstemmed Effects of Zn addition on the intermetallic formation and joint strength of Sn-3.5Ag-1.0Cu solders / Ramani Mayappan and Iziana Yahya
title_sort effects of zn addition on the intermetallic formation and joint strength of sn-3.5ag-1.0cu solders / ramani mayappan and iziana yahya
publisher Penerbit UiTM (UiTM Press)
publishDate 2025
url https://ir.uitm.edu.my/id/eprint/111163/1/111163.pdf
https://ir.uitm.edu.my/id/eprint/111163/
_version_ 1825814855866646528
score 13.244413

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