Effects of Zn addition on the intermetallic formation and joint strength of Sn-3.5Ag-1.0Cu solders / Ramani Mayappan and Iziana Yahya
The need to replace lead-based solders has received considerable attention among researchers because of their toxicity. The Sn-Ag-Cu family is the most promising candidate. However, these solder systems require some improvement in terms of their performances in terms of mechanical properties. In thi...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit UiTM (UiTM Press)
2025
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| Subjects: | |
| Online Access: | https://ir.uitm.edu.my/id/eprint/111163/1/111163.pdf https://ir.uitm.edu.my/id/eprint/111163/ |
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