Deep learning-based yield prediction for the die bonding semiconductor manufacturing process
In the semiconductor manufacturing industry, consistently achieving a high yield is the primary target to meet customer demands and ensure continuous profitability. The ability to predict the yield of a particular manufacturing process at either the Front of Line or End of Line facilities is therefo...
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| Main Authors: | , , , |
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| 格式: | Proceeding Paper |
| 語言: | English English |
| 出版: |
Springer
2025
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| 主題: | |
| 在線閱讀: | http://irep.iium.edu.my/114600/1/114600_Deep%20learning-based%20yield%20prediction.pdf http://irep.iium.edu.my/114600/7/114600_Deep%20learning-based%20yield%20prediction_SCOPUS.pdf http://irep.iium.edu.my/114600/ https://link.springer.com/chapter/10.1007/978-981-97-3851-9_7 |
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