APA Citation

Akbar, M. A. (2025). Deep learning-based yield prediction for the die bonding semiconductor manufacturing process. Springer.

Chicago Style Citation

Akbar, Muhammad Ali. Deep Learning-based Yield Prediction for the Die Bonding Semiconductor Manufacturing Process. Springer, 2025.

MLA Citation

Akbar, Muhammad Ali. Deep Learning-based Yield Prediction for the Die Bonding Semiconductor Manufacturing Process. Springer, 2025.

Warning: These citations may not always be 100% accurate.