Influence of adhesive curing temperature and geometrical parameters on composite patch repair of cracked structures
Revitalizing aircraft structural components marred by damage is imperative to enhance their operational lifespan, obviating the need for wholesale replacement of parts or even the entire airframe. The application of composite patches for mending fractured structures contributes significantly to p...
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| 主要な著者: | , , , |
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| フォーマット: | 論文 |
| 言語: | English English |
| 出版事項: |
Semarak Ilmu Publishing
2024
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| 主題: | |
| オンライン･アクセス: | http://irep.iium.edu.my/114089/13/114089_%20Influence%20of%20adhesive%20curing%20temperature.pdf http://irep.iium.edu.my/114089/14/114089_%20Influence%20of%20adhesive%20curing%20temperature_Scopus.pdf http://irep.iium.edu.my/114089/ https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/article/view/10495 https://doi.org/10.37934/arfmts.119.1.112 |
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| 要約: | Revitalizing aircraft structural components marred by damage is imperative to enhance
their operational lifespan, obviating the need for wholesale replacement of parts or even
the entire airframe. The application of composite patches for mending fractured
structures contributes significantly to prolonging their serviceability. However, this
strategy often mandates curing the adhesive at temperatures surpassing ambient
conditions. Hence, the present investigation centers on the reparation of a cracked plate
via a composite patch under conditions of thermo-mechanical loading. The study also
delves into the repercussions of thermal stresses on the Stress Intensity Factor (SIF),
engendered by elevated curing temperatures. By executing Finite Element Analysis (FEA),
the SIF at the crack tip was computed, and a parametric examination was executed to
scrutinize the influence of assorted parameters such as the thickness of the patch and
adhesive on SIF, leveraging the ANSYS tool. Notably, the existence of a composite patch
resulted in a substantial reduction of SIF, with noteworthy SIF alterations arising from
parameter variations. Elevation in SIF, prompted by thermal stresses due to adhesive
curing, was found to manifest markedly, a predicament that can be mitigated by effecting
adhesive curing at ambient temperatures. |
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