Numerical evaluation of adhesive bonding quality using electromechanical impedance technique
A joint is a crucial approach in the engineering field, especially when it comes to the completion of a structure. Engineers must inspect the structure's quality so that damage can be avoided. Many academic and industry researchers have recently expressed interest in the creation of a real-t...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English English |
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Semarak Ilmu Publishing
2024
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/114088/3/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality_SCOPUS.pdf http://irep.iium.edu.my/114088/4/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality.pdf http://irep.iium.edu.my/114088/ https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5219/5322 https://doi.org/10.37934/aram.120.1.122135 |
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http://irep.iium.edu.my/114088/3/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality_SCOPUS.pdfhttp://irep.iium.edu.my/114088/4/114088_Numerical%20evaluation%20of%20adhesive%20bonding%20quality.pdf
http://irep.iium.edu.my/114088/
https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5219/5322
https://doi.org/10.37934/aram.120.1.122135