Optimization of Electroless Plating Solution Parameter for Coating PETG Electrode with Copper using Design of Experiment (DOE)

In the study, an attempt was made to electrolessly plate copper onto PETG plastics that aren't conductors. Three manipulating factors, i.e. volume of copper sulphate and sulphuric acid (A), volume of sulphuric acid (B), and mass of copper sulphate (C), were selected and carried out using Taguch...

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Bibliographic Details

Main Authors:	Mun Kit, Fong, Abdul Haq, Reazul Haq, Singh, Yashvir, Abdul Ghafir, Mohammad Fahmi, Hassan, Mohd Fahrul, Syed Abu Bakar, Sharifah Adzila, Hoffmann, Jörg
Format:	Article
Language:	en
Published:	semarak ilmu 2025
Subjects:	TP Chemical technology
Online Access:	http://eprints.uthm.edu.my/12778/1/J19360_69ada09529f314df20f99a0381c162bd.pdf http://eprints.uthm.edu.my/12778/ https://doi.org/10.37934/aram.125.1.113
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