APA (7th ed.) Citation

Suresh, K., Subramonian, S., MT, C., Azmeer, M., & Harun, F. (2010). Solving eventual bonding quality to enhance adhesion for QFN packages. IEEE.

Chicago Style (17th ed.) Citation

Suresh, Kumar, Sivarao Subramonian, Cheong MT, Mohd Azmeer, and Fuaida Harun. Solving Eventual Bonding Quality to Enhance Adhesion for QFN Packages. IEEE, 2010.

MLA (9th ed.) Citation

Suresh, Kumar, et al. Solving Eventual Bonding Quality to Enhance Adhesion for QFN Packages. IEEE, 2010.