Solving eventual bonding quality to enhance adhesion for QFN packages
Many of the components used extensively in today's handheld market are beginning to migrate from traditional lead frame design to lead less or non leaded. The primary driver for handheld manufacturers is the saved PC board space created by these components' smaller mounting areas. In addit...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | en |
| Published: |
IEEE
2010
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| Online Access: | http://eprints.utem.edu.my/id/eprint/9310/1/05746711.pdf http://eprints.utem.edu.my/id/eprint/9310/ https://ieeexplore.ieee.org/document/5746711/authors#authors |
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