Influence of Wafer Probing Against Initial Bonding
Wafer probing technology is a critical testing technology used in the semiconductor manufacturing and packaging process. A well-designed probing system must enable low and stable contact resistance when each needle-like probe makes contact with the IC chip-bonding pad. During wafer testing, probe ne...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | en |
| Published: |
2010
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/9306/1/Influence_of_Wafer_Probing_Against_Initial_Bonding.pdf http://eprints.utem.edu.my/id/eprint/9306/ |
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