Micro-structural studies of thermosonic Cu-Al bonding interface
Thermosonic Copper (Cu) wire interconnection has been under an extensive research and development with objective to replace expensive Gold (Au) wire material in the semiconductor industry. However, a reliability concern is raised due to void formation at the bonding interface of Copper wire-Aluminum...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | en |
| Published: |
2013
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/9148/1/Bond_21_Anand_and_Chua.pdf http://eprints.utem.edu.my/id/eprint/9148/ http://bond21.unimap.edu.my/ |
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