X-ray Diffraction Study of Intermetallic Cu-Al Interconnection in Electronic Components

Cu wire bonding has been an emerging interconnection technique for semiconductor industry. Research of intermetallic compounds (IMCs) of Cu (wire) – Al (bond pad metallization) in nanometer scale at the bonding interface is usually carried out with expensive and time consuming analytical techniques....

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Bibliographic Details

Main Authors:	Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Hng, May Ting, Lee, Cher Chia
Format:	Conference or Workshop Item
Language:	en
Published:	2012
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utem.edu.my/id/eprint/6957/1/XRD_Study_of_Intermetallic_Cu-Al_Interconnection.pdf http://eprints.utem.edu.my/id/eprint/6957/ http://www.mrs.org.sg/icyram2012/public.asp?page=venue.asp
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