Low-cost integrated circuit packaging defect classification system using edge impulse and ESP32CAM

Defects in integrated circuit (IC) packaging are inevitable. Several factors can cause defects in IC packaging such as material quality, errors in machine and human handling operations, and non-optimized processes. An automated optical inspection (AOI) is a typical method to find defects in the IC m...

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Bibliographic Details

Main Authors:	Mispan, Mohd Syafiq, Kamaruddin, Muhammad Adni, Jidin, Aiman Zakwan, Mohd Nasir, Haslinah, Mohd Nor, Nurul Izza
Format:	Article
Language:	en
Published:	Institute Of Advanced Engineering And Science (IAES) 2025
Online Access:	http://eprints.utem.edu.my/id/eprint/28997/2/026041208202591949.pdf http://eprints.utem.edu.my/id/eprint/28997/ https://ijece.iaescore.com/index.php/IJECE/article/view/36951/17918 http://doi.org/10.11591/ijece.v15i1.pp156-162
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