Low-cost integrated circuit packaging defect classification system using edge impulse and ESP32CAM
Defects in integrated circuit (IC) packaging are inevitable. Several factors can cause defects in IC packaging such as material quality, errors in machine and human handling operations, and non-optimized processes. An automated optical inspection (AOI) is a typical method to find defects in the IC m...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | en |
| Published: |
Institute Of Advanced Engineering And Science (IAES)
2025
|
| Online Access: | http://eprints.utem.edu.my/id/eprint/28997/2/026041208202591949.pdf http://eprints.utem.edu.my/id/eprint/28997/ https://ijece.iaescore.com/index.php/IJECE/article/view/36951/17918 http://doi.org/10.11591/ijece.v15i1.pp156-162 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|