Delamination study between leadframe substrate and epoxy mold compound for small outline semiconductor packaging
Superior quality and reliable semiconductor integrated circuit (IC) packaging is required in electronic products especially for automotive applications due to the user safety concern. Therefore, improvement and controlling of IC package defects to reduce field application and reliability failure is...
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| Format: | Thesis |
| Language: | en en |
| Published: |
2024
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| Online Access: | http://eprints.utem.edu.my/id/eprint/28596/1/Delamination%20study%20between%20leadframe%20substrate%20and%20epoxy%20mold%20compound%20for%20small%20outline%20semiconductor%20packaging.pdf http://eprints.utem.edu.my/id/eprint/28596/2/Delamination%20study%20between%20leadframe%20substrate%20and%20epoxy%20mold%20compound%20for%20small%20outline%20semiconductor%20packaging.pdf http://eprints.utem.edu.my/id/eprint/28596/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=124364 |
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http://eprints.utem.edu.my/id/eprint/28596/1/Delamination%20study%20between%20leadframe%20substrate%20and%20epoxy%20mold%20compound%20for%20small%20outline%20semiconductor%20packaging.pdfhttp://eprints.utem.edu.my/id/eprint/28596/2/Delamination%20study%20between%20leadframe%20substrate%20and%20epoxy%20mold%20compound%20for%20small%20outline%20semiconductor%20packaging.pdf
http://eprints.utem.edu.my/id/eprint/28596/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=124364