Thermosonic micro-interconnections: Interfacial Cu-Al intermetallics compound growth studies based on stress modelling

One of the most common wire bonding technology involving copper (Cu) wire interconnections is the thermosonic bonding technique. Still, the volumetric changes of intermetallic compounds (IMCs) formed at the bonding interface of Cu wire on Al bond pads induce voids formation in the Cu-Al IMC layer. T...

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Bibliographic Details

Main Author:	Sharir, Shariza
Format:	Thesis
Language:	en
Published:	2024
Subjects:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering TN Mining engineering. Metallurgy
Online Access:	http://eprints.utem.edu.my/id/eprint/28287/2/Thermosonic%20micro-interconnections-%20Interfacial%20Cu-Al%20intermetallics%20compound%20growth%20studies%20based%20on%20stress%20modelling.pdf http://eprints.utem.edu.my/id/eprint/28287/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=124134
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