Optimal Pin Fin Arrangement of Heat Sink Design and Thermal Analysis for Central Processing Unit

Heat sink is the most popular device used for electronic cooling. A continuing in increasing of power density in CPU processor, by reducing the size of electronic products has led to the importance of thermal management issue in this industry. This issue will reduce the performance of the CPU proces...

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Bibliographic Details

Main Authors:	Mohd Annuar, Khalil Azha, Ismail, Fatimah Sham
Format:	Conference or Workshop Item
Language:	en
Published:	2014
Subjects:	Q Science (General) TA Engineering (General). Civil engineering (General)
Online Access:	http://eprints.utem.edu.my/id/eprint/13494/2/articleDetails.jsp%3Freload%3Dtrue%26arnumber%3D6869537 http://eprints.utem.edu.my/id/eprint/13494/ http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6869537
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