Thickness Dependence of The Surface Roughness of Micro Contact Deposited By Dc Magnetron Sputtering Technique
Integrated circuits are tested in final step of IC packaging to verify that required electrical connections are working properly. At present, Pogo Pins are used as electrical connection between IC lead and load board. Pogo pins caused different problems including indentation marks, blur marks, tilt...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | en |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/12546/1/JJAP463B1312.pdf http://eprints.utem.edu.my/id/eprint/12546/ |
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