Thangaraj, J. S. A., Chua, K. Y., & Jalar, A. (2014). Micro-structural Studies of Thermosonic Cu-Al Bonding Interface. Trans Tech Publications.
Chicago Style (17th ed.) CitationThangaraj, Joseph Sahaya Anand, Kok Yau Chua, and Azman Jalar. Micro-structural Studies of Thermosonic Cu-Al Bonding Interface. Trans Tech Publications, 2014.
MLA (9th ed.) CitationThangaraj, Joseph Sahaya Anand, et al. Micro-structural Studies of Thermosonic Cu-Al Bonding Interface. Trans Tech Publications, 2014.
Warning: These citations may not always be 100% accurate.
