Micro-structural Studies of Thermosonic Cu-Al Bonding Interface
Thermosonic Copper (Cu) wire interconnection has been under an extensive research and development to replace expensive Gold (Au) wire material in the semiconductor industry. However, a reliability concern is raised due to void formation at the bonding interface of Copper wire-Aluminum bond pad (Cu-A...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | en |
| Published: |
Trans Tech Publications
2014
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| Online Access: | http://eprints.utem.edu.my/id/eprint/12158/1/36_AMR_925.pdf http://eprints.utem.edu.my/id/eprint/12158/ http://www.scientific.net |
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