Fabrication of deep micro-holes in reaction-bonded SiC by ultrasonic cavitation assisted micro-EDM

Ultrasonic vibration was applied to dielectric fluid by a probe-type vibrator to assist micro electrical discharge machining of deep micro-holes in ceramic materials. Changes of machined hole depth, hole geometry, surface topography, machining stability and tool material deposition under various ma...

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Bibliographic Details
Main Authors: Liew , Pay Jun, Yan , Jiwang, Kuriyagawa, Tsunemoto
Format: Article
Language:en
Published: Elsevier 2014
Subjects:
Online Access:http://eprints.utem.edu.my/id/eprint/10918/1/Fabrication_of_deep_micro-holes_in_reaction-bonded_SiC_by_ultrasonic_cavitation_assisted_micro-EDM.pdf
http://eprints.utem.edu.my/id/eprint/10918/
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