Experimental investigation on material migration phenomena in micro-EDM of reaction-bonded silicon carbide
Material migration between tool electrode and workpiece material in micro electrical discharge machining of reaction-bonded silicon carbide was experimentally investigated. The microstructural changes of workpiece and tungsten tool electrode were examined using scanning electron microscopy, cross se...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | en |
| Published: |
Elsevier
2013
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/10916/1/Experimental_investigation_on_material_migration_phenomena_in_micro-EDM_of_reaction-bonded_silicon_carbide.pdf http://eprints.utem.edu.my/id/eprint/10916/ |
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