APA (7th ed.) Citation

S, M., M.I, M. G., K, W., D, K., P, C., & Environment, F. o. E. a. B. (2024). 3D printed interposer layer for high density packaging of IoT devices. Institute of Electrical and Electronics Engineers Inc.

Chicago Style (17th ed.) Citation

S, Mondal, Mohd Ghazali M.I, Wijewardena K, Kumar D, Chahal P, and Faculty of Engineering and Built Environment. 3D Printed Interposer Layer for High Density Packaging of IoT Devices. Institute of Electrical and Electronics Engineers Inc, 2024.

MLA (9th ed.) Citation

S, Mondal, et al. 3D Printed Interposer Layer for High Density Packaging of IoT Devices. Institute of Electrical and Electronics Engineers Inc, 2024.