3D printed interposer layer for high density packaging of IoT devices

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Bibliographic Details
Main Authors:	Mondal S., Mohd Ghazali M.I., Wijewardena K., Kumar D., Chahal P.
Other Authors:	Faculty of Engineering and Built Environment
Format:	conference output::conference proceedings::conference paper
Language:	English en_US
Published:	Institute of Electrical and Electronics Engineers Inc. 2024
Subjects:	3D printing Energy harvesting Interposer Passive Wireless Internet of things Network components Radio 3-D printing Design and simulation Digital modulators Heterogeneous component High-density packaging Vertical stacking 3D printers
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