Text this :: MALRep

Skip to content

Skip to content

+604 9283627
uumlib@uum.edu.my

MALRep Discovery Service

Facebook
Twitter
Youtube
Instagram

Discover MALRep

Malaysian Academic Library Institutional Repository

Search for:

Home
Discovery Options
About
- About MALRep Discovery Service
- FAQs

Advanced

3D Printed Interposer Layer fo...
Text this

Text this: 3D Printed Interposer Layer for High Density Packaging of IoT Devices

Number:

Provider:

Copyright. All rights reserved. 2025 © Perpustakaan Sultanah Bahiyah, Universiti Utara Malaysia (UUM)