3D Printed Interposer Layer for High Density Packaging of IoT Devices
3D printing has emerged as a potential solution to fabricate different RF components and embed prepackaged devices. In this work, 3D printed interposer layer is proposed to enable vertical stacking of different heterogeneous components and substrates. Different design parameters were first simulated...
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| Main Authors: | , , , , |
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| Format: | Proceedings Paper |
| Language: | English en_US |
| Published: |
IEEE
2024
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| Subjects: | |
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