Thermal-Aware NoC for AI Computing: Tools, Algorithms, and Applications

The explosive growth of AI workloads elevates on-chip communication and heat dissipation to first-order constraints. This survey paper consolidates thermal-aware Network-on-Chip (NoC) design for AI computing across tools, algorithms, and applications. Concretely, we first assemble a reproducible too...

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Bibliographic Details

Main Authors:	Rokhani, Fakhrul Zaman, Stan, Mircea R., Palesi, Maurizio, Chen, Kun Chih
Format:	Article
Language:	en
Published:	Institute of Electrical and Electronics Engineers Inc. 2026
Subjects:	Electronic, Optical and Magnetic Materials Signal Processing
Online Access:	http://psasir.upm.edu.my/id/eprint/124066/1/124066.pdf http://psasir.upm.edu.my/id/eprint/124066/ https://ieeexplore.ieee.org/document/11381451/
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