Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: materials and technologies
The electronic industry faces a number of issues as a result of the rapid miniaturization of electronic products and the expansion of application areas, with the reliability of electronic packaging materials playing a significant role. Moreover, the continuously harsh service conditions of electroni...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | en |
| Published: |
Elsevier Editora Ltda
2023
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| Online Access: | http://psasir.upm.edu.my/id/eprint/110327/1/110327.pdf http://psasir.upm.edu.my/id/eprint/110327/ https://www.sciencedirect.com/science/article/pii/S2238785423014412 |
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