APA (7th ed.) Citation

M.D, A., M.Z, A., M.S.A, A., R, K., P, G., & 57527077400. (2023). Recent advances on thermally conductive adhesive in electronic packaging: A review. MDPI.

Chicago Style (17th ed.) Citation

M.D, Alim, Abdullah M.Z, Aziz M.S.A, Kamarudin R, Gunnasegaran P, and 57527077400. Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review. MDPI, 2023.

MLA (9th ed.) Citation

M.D, Alim, et al. Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review. MDPI, 2023.