Recent advances on thermally conductive adhesive in electronic packaging: A review
Adhesives; Electronics packaging; Fillers; Nanocomposites; Nanoparticles; Temperature control; Bonding strength; Conductive fillers; Electronic Packaging; Epoxy adhesives; Epoxy-based; Nano composite; Thermal; Thermally conductive adhesive; Thermally conductive adhesives; Thermal conductivity
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| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Review |
| Published: |
MDPI
2023
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