Experimental and numerical study on thin silicon wafer CO2 laser cutting and damage investigation

This study investigates laser-induced damage in thin silicon (Si) wafer ablation both experimentally and numerically. A 40-W continuous-wave CO2 laser is employed as the volumetric heat source. Experiments are conducted that involve variations in the laser cutting speed from 5 to 20 mm/s and the num...

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Bibliographic Details

Main Authors:	Kaveh, Moghadasi, Khairul Fikri, Tamrin, Nadeem Ahmed, Sheikh, Abdul Rahman, Kram, Pierre, Barroy, Fahizan, Mahmud, Amir Azam, Khan
Format:	Article
Language:	en
Published:	Springer Nature 2024
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://ir.unimas.my/id/eprint/49535/1/s00170-024-13675-9.pdf http://ir.unimas.my/id/eprint/49535/ https://link.springer.com/article/10.1007/s00170-024-13675-9 https://doi.org/10.1007/s00170-024-13675-9
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