Thermal analyses of minichannels and use of mathematical and numerical models
Growth in electronic devices comes with a challenge to engineers to provide proficient cooling mechanism in order to evade performance decline. Minichannel heat sinks are one among type of cooling devices to absorb heat formed in the electronic devices. Air is largely employed as cooling fluid in mi...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Published: |
Taylor & Francis
2020
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/24876/ https://doi.org/10.1080/10407782.2019.1701883 |
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