Brazing of porous copper foam/copper with amorphous Cu-9.7Sn-5.7Ni-7.0P (wt%) filler metal: interfacial microstructure and diffusion behavior

In this work, brazing of porous copper foam (PCF) to copper (Cu) using amorphous Cu-9.7Sn-5.7Ni-7.0P (in weight, wt%) filler metal has been performed. PCF with different pore densities of 15 pore per inch (PPI), 25 PPI, and 50 PPI were sandwiched in between amorphous Cu-9.7Sn-5.7Ni-7.0P filler/Cu ba...

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Bibliographic Details

Main Authors:	Zahri, Nur Amirah Mohd, Yusof, Farazila, Miyashita, Yukio, Ariga, Tadashi, Haseeb, A.S. Md. Abdul, Jamadon, Nashrah Hani, Sukiman, Nazatul Liana
Format:	Article
Published:	Springer Verlag (Germany) 2020
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.um.edu.my/24598/ https://doi.org/10.1007/s40194-019-00804-2
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