Performances and procedures modules in micro electro mechanical system packaging technologies

This paper presents the challenging issues in micro electro mechanical system (MEMS) packing technologies. The MEMS package includes a MEMS device and a signal conditioning electronic circuit. In one viewpoint, MEMS application is categorized by the type of sensor, actuator, and structure. MEMS tech...

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Bibliographic Details

Main Authors:	Amiri, Iraj Sadegh, Ariannejad, Mohammad Mahdi, Vigneswaran, Dhasarathan, Lim, Chin Seong, Yupapin, Preecha Promphan
Format:	Article
Published:	Elsevier 2018
Subjects:	QC Physics TJ Mechanical engineering and machinery TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.um.edu.my/22495/ https://doi.org/10.1016/j.rinp.2018.09.008
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