Reflow of Sn-3.8Ag-O.7Cu solder on Ni substrate in presence of Mo nanoparticles
In this study, Mo nanoparticles were used as a reinforcing material into the Sn-3.8Ag-0.7Cu (SAC) solder on the nickel (Ni) substrate electrodeposited on polycrystalline copper (Cu) sheets. The Mo nanoparticles were characterized by transmission electron microscopy (TEM) and X-ray diffractometer (...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | en |
| Published: |
2013
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/15616/1/0001.pdf http://eprints.um.edu.my/15616/ |
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