Thermal characteristic of sintered Ag-Cu nanopaste for high-temperature die-attach application
In this work, thermal characteristic of silver-copper (Ag-Cu) nanopaste that consists of a mixture of nano-sized Ag and Cu particles and organic compounds meant for high-temperature die-attach application is reported. The Ag-Cu nanopaste was sintered at 380 degrees C for 30 min without the need of a...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | en |
| Published: |
2015
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/13918/1/Thermal_characteristic_of_sintered_Ag-Cu_nanopaste_for_high.pdf http://eprints.um.edu.my/13918/ http://www.sciencedirect.com/science/article/pii/S1290072914002488 |
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