Floating mechanism of the passive electronic component of the die-side capacitor

Reflow soldering is a widely used process in mass production, particularly in electronic assembly lines. However, defects such as solder bridging, fillet lifting, and tombstoning often arise due to capillary forces that act on molten solder during the transient liquefaction phase. This study investi...

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Bibliographic Details

Main Authors:	Abu Kasim, Haszeme, Mat Shah, Muhammad Amir, Mohd Yusof, Ab Aziz
Other Authors:	Rusli, Ahmad Najmie
Format:	Book Section
Language:	en
Published:	Universiti Teknologi MARA Cawangan Johor Kampus Pasir Gudang 2025
Subjects:	Machine construction (General) Solder and soldering
Online Access:	https://ir.uitm.edu.my/id/eprint/129250/1/129250.pdf https://ir.uitm.edu.my/id/eprint/129250/
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