MEMS and EFF Technology based micro connector for future miniature devices
The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Proceeding Paper |
| Language: | en en |
| Published: |
2013
|
| Subjects: | |
| Online Access: | http://irep.iium.edu.my/33343/1/2129_MEMS_and_EFF_Technology_based_Micro_Connector_for.pdf http://irep.iium.edu.my/33343/2/ICOM13_Programme_Book.pdf http://irep.iium.edu.my/33343/ http://www.iium.edu.my/icom2013/13/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|