CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
This research provides a thorough analysis of the function of thermal boundary layers in the electronic component cooling process, emphasising the significance of heat sink application and design. We explore the performance of various heat sink topologies under varied thermal boundary conditions usi...
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| 格式: | Final Year Project |
| 语言: | English |
| 出版: |
2024
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| 主题: | |
| 在线阅读: | http://utpedia.utp.edu.my/id/eprint/28822/1/FINAL%20DISSERTATION_MUHAMMAD%20ZHARIF%20MIFDHAL%20BIN%20MOHD%20HANIF_19000679_ME1%20-%20Zarif.pdf http://utpedia.utp.edu.my/id/eprint/28822/ |
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