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CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.

This research provides a thorough analysis of the function of thermal boundary layers in the electronic component cooling process, emphasising the significance of heat sink application and design. We explore the performance of various heat sink topologies under varied thermal boundary conditions usi...

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主要作者: Mohd Hanif, Muhammad Zharif Mifdhal
格式: Final Year Project
語言:English
出版: 2024
主題:
TJ Mechanical engineering and machinery
在線閱讀:http://utpedia.utp.edu.my/id/eprint/28822/1/FINAL%20DISSERTATION_MUHAMMAD%20ZHARIF%20MIFDHAL%20BIN%20MOHD%20HANIF_19000679_ME1%20-%20Zarif.pdf
http://utpedia.utp.edu.my/id/eprint/28822/
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id oai:utpedia.utp.edu.my:28822
record_format eprints
spelling oai:utpedia.utp.edu.my:288222025-03-06T15:05:27Z http://utpedia.utp.edu.my/id/eprint/28822/ CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. Mohd Hanif, Muhammad Zharif Mifdhal TJ Mechanical engineering and machinery This research provides a thorough analysis of the function of thermal boundary layers in the electronic component cooling process, emphasising the significance of heat sink application and design. We explore the performance of various heat sink topologies under varied thermal boundary conditions using the capabilities of Computational Fluid Dynamics (CFD) modelling. The key objective performs numerical computer investigation by modelling heat sink design with different fin in order to breaking the thermal boundary layer and increase Nusselt number and to investigate different of heat sink design including inline, stagger and further stagger configuration and compare with objective 1 to determine which configuration best to improve Nusselt number. This study gives a complete simulation of the heat sink under various conditions based on a rigorous exploration of fluid dynamics and heat transfer principles. The methodology used to conduct research to breaking the thermal boundary by using different configuration will be covered in the methodology part. Finally, there is a conclusion that discusses the relevance of the aims and recommendations for the propose work. 2024-01 Final Year Project NonPeerReviewed text en http://utpedia.utp.edu.my/id/eprint/28822/1/FINAL%20DISSERTATION_MUHAMMAD%20ZHARIF%20MIFDHAL%20BIN%20MOHD%20HANIF_19000679_ME1%20-%20Zarif.pdf Mohd Hanif, Muhammad Zharif Mifdhal (2024) CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. [Final Year Project] (Submitted)
institution Universiti Teknologi Petronas
building UTP Resource Centre
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Petronas
content_source UTP Electronic and Digitized Intellectual Asset
url_provider http://utpedia.utp.edu.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Mohd Hanif, Muhammad Zharif Mifdhal
CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
description This research provides a thorough analysis of the function of thermal boundary layers in the electronic component cooling process, emphasising the significance of heat sink application and design. We explore the performance of various heat sink topologies under varied thermal boundary conditions using the capabilities of Computational Fluid Dynamics (CFD) modelling. The key objective performs numerical computer investigation by modelling heat sink design with different fin in order to breaking the thermal boundary layer and increase Nusselt number and to investigate different of heat sink design including inline, stagger and further stagger configuration and compare with objective 1 to determine which configuration best to improve Nusselt number. This study gives a complete simulation of the heat sink under various conditions based on a rigorous exploration of fluid dynamics and heat transfer principles. The methodology used to conduct research to breaking the thermal boundary by using different configuration will be covered in the methodology part. Finally, there is a conclusion that discusses the relevance of the aims and recommendations for the propose work.
format Final Year Project
author Mohd Hanif, Muhammad Zharif Mifdhal
author_facet Mohd Hanif, Muhammad Zharif Mifdhal
author_sort Mohd Hanif, Muhammad Zharif Mifdhal
title CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
title_short CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
title_full CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
title_fullStr CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
title_full_unstemmed CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
title_sort cfd modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
publishDate 2024
url http://utpedia.utp.edu.my/id/eprint/28822/1/FINAL%20DISSERTATION_MUHAMMAD%20ZHARIF%20MIFDHAL%20BIN%20MOHD%20HANIF_19000679_ME1%20-%20Zarif.pdf
http://utpedia.utp.edu.my/id/eprint/28822/
_version_ 1826072830555455488
score 13.251813

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