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Effect of Particle Dispersion on Thermal Conductivity of Copper Powder Filled Epoxy Composites

The thermal conductivity of the epoxy can be enhanced by incorporating conductive particles. These materials have potential to be used as heat sink in electronic devices. This paper presents the results of developing copper powder reinforced epoxy composite and measurement of their thermal conductiv...

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Main Authors: Megat-Yusoff, P.S.M., Ahmad, Faiz, Amir, Norlaili, Leong, S.F.
Format: Book
Published: UPENA, UiTM 2007
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utp.edu.my/5902/1/GetabsServlet%3Fprog%3Dnormal%26id%3DAPCPCS001217000001000363000001%26idtype%3Dcvips%26gifs%3Dyes%26ref%3Dno
http://eprints.utp.edu.my/5902/
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spelling my.utp.eprints.59022017-01-19T08:27:08Z Effect of Particle Dispersion on Thermal Conductivity of Copper Powder Filled Epoxy Composites Megat-Yusoff, P.S.M. Ahmad, Faiz Amir, Norlaili Leong, S.F. TJ Mechanical engineering and machinery The thermal conductivity of the epoxy can be enhanced by incorporating conductive particles. These materials have potential to be used as heat sink in electronic devices. This paper presents the results of developing copper powder reinforced epoxy composite and measurement of their thermal conductivity. Epoxy composites containing 5, 10 and 15 wt% copper particles were developed and the thermal conductivities were measured using the guarded comparative longitudinal heat flow technique. The thermal conductivity of 100% epoxy was found to be 0.204±0.018 W/m-K and this value was 10% less compared to that of the theoretical value. The thermal conductivity measured for the epoxy composites containing 5 wt%, 10 wt% and 15 wt% copper powder were 0.512±0.115, 2.094±0.080 and 2.432±0.210 W/m-K, respectively. Scanning Electron Microscope (SEM) was used to examine the dispersion of copper particles in the epoxy. Poor dispersion of the conductive filler in the epoxy led to the formation of agglomerates resulting in reduced thermal conductivity of the epoxy composites. UPENA, UiTM 2007 Book PeerReviewed application/pdf http://eprints.utp.edu.my/5902/1/GetabsServlet%3Fprog%3Dnormal%26id%3DAPCPCS001217000001000363000001%26idtype%3Dcvips%26gifs%3Dyes%26ref%3Dno Megat-Yusoff, P.S.M. and Ahmad, Faiz and Amir, Norlaili and Leong, S.F. (2007) Effect of Particle Dispersion on Thermal Conductivity of Copper Powder Filled Epoxy Composites. International Conference on Advancement of Materials and Nanotechnology . UPENA, UiTM, Kuala Lumpur. ISBN 978-983-3644-95-7 http://eprints.utp.edu.my/5902/
institution Universiti Teknologi Petronas
building UTP Resource Centre
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Petronas
content_source UTP Institutional Repository
url_provider http://eprints.utp.edu.my/
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Megat-Yusoff, P.S.M.
Ahmad, Faiz
Amir, Norlaili
Leong, S.F.
Effect of Particle Dispersion on Thermal Conductivity of Copper Powder Filled Epoxy Composites
description The thermal conductivity of the epoxy can be enhanced by incorporating conductive particles. These materials have potential to be used as heat sink in electronic devices. This paper presents the results of developing copper powder reinforced epoxy composite and measurement of their thermal conductivity. Epoxy composites containing 5, 10 and 15 wt% copper particles were developed and the thermal conductivities were measured using the guarded comparative longitudinal heat flow technique. The thermal conductivity of 100% epoxy was found to be 0.204±0.018 W/m-K and this value was 10% less compared to that of the theoretical value. The thermal conductivity measured for the epoxy composites containing 5 wt%, 10 wt% and 15 wt% copper powder were 0.512±0.115, 2.094±0.080 and 2.432±0.210 W/m-K, respectively. Scanning Electron Microscope (SEM) was used to examine the dispersion of copper particles in the epoxy. Poor dispersion of the conductive filler in the epoxy led to the formation of agglomerates resulting in reduced thermal conductivity of the epoxy composites.
format Book
author Megat-Yusoff, P.S.M.
Ahmad, Faiz
Amir, Norlaili
Leong, S.F.
author_facet Megat-Yusoff, P.S.M.
Ahmad, Faiz
Amir, Norlaili
Leong, S.F.
author_sort Megat-Yusoff, P.S.M.
title Effect of Particle Dispersion on Thermal Conductivity of Copper Powder Filled Epoxy Composites
title_short Effect of Particle Dispersion on Thermal Conductivity of Copper Powder Filled Epoxy Composites
title_full Effect of Particle Dispersion on Thermal Conductivity of Copper Powder Filled Epoxy Composites
title_fullStr Effect of Particle Dispersion on Thermal Conductivity of Copper Powder Filled Epoxy Composites
title_full_unstemmed Effect of Particle Dispersion on Thermal Conductivity of Copper Powder Filled Epoxy Composites
title_sort effect of particle dispersion on thermal conductivity of copper powder filled epoxy composites
publisher UPENA, UiTM
publishDate 2007
url http://eprints.utp.edu.my/5902/1/GetabsServlet%3Fprog%3Dnormal%26id%3DAPCPCS001217000001000363000001%26idtype%3Dcvips%26gifs%3Dyes%26ref%3Dno
http://eprints.utp.edu.my/5902/
_version_ 1738655443484409856
score 13.211869

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