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Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites

The thermal conductivity of the epoxy can be enhanced by incorporating conductive particles. These materials have the potential to be used as heat sink in electronic devices. This paper presents the results of developing copper powder reinforced epoxy composite and measurements of their thermal cond...

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書誌詳細
主要な著者:	Megat-Yusoff, Puteri Sri Melor, Ahmad, Faiz, Amir, Norlaili, Leong, Siew Yoong
フォーマット:	論文
出版事項:	American Institute of Physics 2010
主題:	QD Chemistry
オンライン･アクセス:	http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=APCPCS001217000001000363000001&idtype=cvips&gifs=yes&ref=no http://eprints.utp.edu.my/5899/
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