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Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites

The thermal conductivity of the epoxy can be enhanced by incorporating conductive particles. These materials have the potential to be used as heat sink in electronic devices. This paper presents the results of developing copper powder reinforced epoxy composite and measurements of their thermal cond...

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Main Authors: Megat-Yusoff, Puteri Sri Melor, Ahmad, Faiz, Amir, Norlaili, Leong, Siew Yoong
Format: Article
Published: American Institute of Physics 2010
Subjects:
QD Chemistry
Online Access:http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=APCPCS001217000001000363000001&idtype=cvips&gifs=yes&ref=no
http://eprints.utp.edu.my/5899/
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spelling my.utp.eprints.58992014-04-01T03:00:33Z Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites Megat-Yusoff, Puteri Sri Melor Ahmad, Faiz Amir, Norlaili Leong, Siew Yoong QD Chemistry The thermal conductivity of the epoxy can be enhanced by incorporating conductive particles. These materials have the potential to be used as heat sink in electronic devices. This paper presents the results of developing copper powder reinforced epoxy composite and measurements of their thermal conductivity. Epoxy composites containing 5, 10 and 15 wt% copper particles were developed and the thermal conductivities were measured using the guarded comparative longitudinal heat flow technique. The thermal conductivity of 100% epoxy was found to be 0.204±0.018 W/m-K and this value was 10% less compared to that of the theoretical value. The thermal conductivity measured for the epoxy composites containing 5wt%, 10wt% and 15wt% copper powder were 0.512±0.115, 2.094±0.080 and 2.432±0.210 W/m-K, respectively. Scanning Electron Microscope (SEM) was used to examine the dispersion of copper particles in the epoxy. Poor dispersion of the conductive filler in the epoxy led to the formation of agglomerates resulting in reduced thermal conductivity of the epoxy composites. American Institute of Physics 2010-03-11 Article PeerReviewed http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=APCPCS001217000001000363000001&idtype=cvips&gifs=yes&ref=no Megat-Yusoff, Puteri Sri Melor and Ahmad, Faiz and Amir, Norlaili and Leong, Siew Yoong (2010) Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites. AIP Conference Proceedings, 1217 (1). pp. 363-369. ISSN 0094243X http://eprints.utp.edu.my/5899/
institution Universiti Teknologi Petronas
building UTP Resource Centre
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Petronas
content_source UTP Institutional Repository
url_provider http://eprints.utp.edu.my/
topic QD Chemistry
spellingShingle QD Chemistry
Megat-Yusoff, Puteri Sri Melor
Ahmad, Faiz
Amir, Norlaili
Leong, Siew Yoong
Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites
description The thermal conductivity of the epoxy can be enhanced by incorporating conductive particles. These materials have the potential to be used as heat sink in electronic devices. This paper presents the results of developing copper powder reinforced epoxy composite and measurements of their thermal conductivity. Epoxy composites containing 5, 10 and 15 wt% copper particles were developed and the thermal conductivities were measured using the guarded comparative longitudinal heat flow technique. The thermal conductivity of 100% epoxy was found to be 0.204±0.018 W/m-K and this value was 10% less compared to that of the theoretical value. The thermal conductivity measured for the epoxy composites containing 5wt%, 10wt% and 15wt% copper powder were 0.512±0.115, 2.094±0.080 and 2.432±0.210 W/m-K, respectively. Scanning Electron Microscope (SEM) was used to examine the dispersion of copper particles in the epoxy. Poor dispersion of the conductive filler in the epoxy led to the formation of agglomerates resulting in reduced thermal conductivity of the epoxy composites.
format Article
author Megat-Yusoff, Puteri Sri Melor
Ahmad, Faiz
Amir, Norlaili
Leong, Siew Yoong
author_facet Megat-Yusoff, Puteri Sri Melor
Ahmad, Faiz
Amir, Norlaili
Leong, Siew Yoong
author_sort Megat-Yusoff, Puteri Sri Melor
title Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites
title_short Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites
title_full Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites
title_fullStr Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites
title_full_unstemmed Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites
title_sort effect of particle dispersion on thermal conductivity of copper powder filled epoxy composites
publisher American Institute of Physics
publishDate 2010
url http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=APCPCS001217000001000363000001&idtype=cvips&gifs=yes&ref=no
http://eprints.utp.edu.my/5899/
_version_ 1738655443210731520
score 13.211869

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